FUSIONQUAD ? technology amkors FUSIONQUAD technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of exposedpad tqfp and mlf technologies. the novel integration of bottom lands in a qfp provides a cost-effective platform for increased lead count in a small form factor. FUSIONQUAD technology not only extends the i/o range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50% reduction in package size for a given lead count. additionally, this technology provides excellent rf electrical performance characteristics with short signal paths to the bottom lands and high power dissipation capability with the solderable exposed die attach paddle. FUSIONQUAD technology offers system architects, ic designers and packaging engineers a unique blend of excellent electrical and thermal performance in a miniaturized cost-effective leadframe plastic package. applications requiring increased data rates or rf communications will benefit from the low insertion loss up to 10 ghz when utilizing the bottom lands for high speed signals. the FUSIONQUAD technology structure also allows the design of multiple segmented power and ground rings typically found in many laminate packages today. along with the thermal performance advantage of the exposedpad tqfp, this technology brings a new lower cost option to applications normally designed into thermally enhanced laminate packages. the unique footprint of this technology allows for the use of low cost printed circuit boards in the end application due to the space available for coarse routing vias between the bottom lands and the outer peripheral leads. the 0.8 mm package thickness allows FUSIONQUAD technology to be applied to end products requiring thin profiles such as mobile hard disk drives, notebook computers and other consumer electronics. applications amkors FUSIONQUAD technology provides an ideal package format for most ic semiconductor technologies including advanced mixed signal socs, motor drivers, microcontrollers, asics, digital signal processors (dsp), and a variety of others. this technology is particularly well suited for applications requiring superior electrical or thermal performance in a cost constrained environment, such as: hard disk drives, laptop pcs, ethernet communication, digital television and data conversion. features ? 10 x 10 mm to 24 x 24 mm body sizes ? 0.8 mm & 1.0 mm body thickness ? increased i/o (116 to 356) in smaller package footprints ? copper leadframe based ? integrated exposed die attach pad ? pb-free/green ? flexible designs for optimal electrical and thermal performance thermal performance pkg body size (mm) exposed pad size (mm) ja (c/w) by velocity (m/s) 0 1.0 2.5 176 ld 14 x 14 6.5 x 6.5 24.6 19.9 17.9 jedec standard test boards (non-thermally optimized) tested @ 1w electrical performance pkg body size (mm) pad size (mm) lead inductance (nh) capacitance (pf) resistance (m) 176 ld 14 x 14 6.5 x 6.5 longest 5.99 0.82 209 C C C shortest 1.42 0.23 81 simulated results @ 100 mhz reliability qualification amkor devices are assembled in optimized package designs with proven reliable semiconductor materials. ? moisture sensitivity jedec level 3, 30c/60% rh, 192 hrs characterization ? temp cycle -65c/+150c, 1000 cycles ? temp/humidity 85c/85% rh, 1000 hours ? high temp storage 150c, 1000 hours ds587d rev date: 7/12 FUSIONQUAD ? visit amkor technology online for locations and to view the most current product information. leadframe data sheet
ds587d rev date: 7/12 cross-sections FUSIONQUAD ? vqfp process highlights ? die thickness 10.0 .5 mils ? strip solder plating matte sn or ni/pd/au ? strip marking laser ? lead inspection laser/optical ? pack/ship options bar code, dry pack ? wafer backgrinding available test services ? program generation/conversion ? product engineering support ? wafer sort ? available test/handling technology ? burn-in capabilities shipping ? jedec outline cs-007 low profile tray configuration options FUSIONQUAD ? package options (mm) body size (mm) total max io number possible peripheral lead max die pad size (mm) dual row land single row land 0.4 pitch 0.5 pitch 0.4 pitch 0.5 pitch 0.4 pitch 0.5 pitch 0.4 pitch 0.5 pitch 10 x 10 164 132 148 116 88 64 5.3 5.3 12 x 12 200 164 176 140 108 80 6.5 6.5 14 x 14 228 192 204 168 128 100 7.3 7.5 16 x 16 264 224 236 196 148 120 8.5 8.7 20 x 20 316 264 280 228 184 144 9.7 10 24 x 24 356 296 320 260 224 176 9.7 10 note: above are estimates only. detailed designs have not yet been implemented for all options. actual pin counts are pad size dependent. FUSIONQUAD ? gold wi re mold com pou nd di e cu leadframe exposed lands exposed die paddle less than 1.00mm seat height 0.8mm body soh: .05 nominal dual row exposed land design single row exposed land design less than 1.00mm seat height 0.8mm body soh: .05 nomina l in te r nal po we r ri ng / ba r with respect to the information in this document, amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. this document does not in any way extend or modify amkors warranty on any product beyond that set forth in its standard terms and conditions of sale. amkor reserves the right to make changes in its product and specifications at any time and without notice. ? 2013, amkor technology incorporated. all rights reserved. visit amkor technology online for locations and to view the most current product information. leadframe data sheet
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